DesignCon - 2006
Designing Scalable 10G Backplane Interconnect Systems Utilizing Advanced Verification Methodologies
CircuiTree - 2005-12
Flex Circuit Packaging with Built-in ESD Protection
SemiConductor International - 2005-11
New Stair Step Approach Simplifies Substrate Design
CircuiTree - 2005-11
Next Generation Copper Based PCB Interconnection Technologies
Cadence.com - 2005-07
Co-design of IC and Package and of Package and Interconnection Substrate
SemiConductor International - 2005-06
Flex Connections Lower Power Off the Top
CircuiTree - 2005-05
Flexible Thinking
Connector Specifier - 2005-05
System-level connector design boosts high-speed applications
CircuiTree - 2005-03
Fjelstad’s Talk Signals a Reprieve for Copper Interconnections
Advanced Packaging - 2005-02
3-D Partitioning of Printed Circuit Design - Elevated Highway Bypass Packaging Design”, Joseph Fjelstad, Gary Yasumara, and Kevin Grundy
Business Wire - 2005-01-05
An Alternative Approach to PCD Design - Joe Fjelstad
Circuits Assembly - 2005-02
Joe Fjelstad of SiliconPipe to Speak at SiP
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