June 2001	First provisional patent filed
January 2001	SiliconPipe incorporated
March 2002	First formal patent filing
May 2002	First prototypes of AirCore substrate technology fabricated
February 2003	25th patent filed
November 2003	First 40Gbps “Clean Channel” demonstrated over 30-inches
December 2003	50th patent filed
January 2004	SiliconPipe refines its business plan to become the worlds first “fabless interconnect company”
February 2004	Physical demonstration of Off-the-Top technology
March 2004	Off-the-Top (OTT) IC packaging technology announced
March 2004	Alliance with Possehl Electronics to build Off-the-Top (OTT) package
June 2004	70th patent filed
June 2004	Fully modeled 25Gbps chip-to-chip system based on the use of all standard manufacturing technologies completed
July 2004	First Off-the-Top (OTT) substrates produced
July 2004	Winner of the Advanced Pakaging Innovative Packaging award
January 2005	100th patent filed
March 2005	Finalist for EE Times ACE Award, Most Innovative Packaging Award
March 2005	Off-the-Top packaging formally announced
March 2005	10Gbps copper interconnect proof of concept completed
June 2005	Nano Cluster partnership announced
October 2005	StairStep package announced